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Deployment Guide Updated

800G OSFP Thermal Design and Port Validation

Plan 800G OSFP thermal design, cooling, port validation, FEC, link budget and acceptance conditions for high-density deployment.

AI compute room with 400G and 800G optical interconnect illustration

Start with the host and complete link

Stable 800G operation depends on airflow, cage cooling, port power, FEC, fiber mapping, remote PMD and the complete link budget. Build a traceable host-module-link matrix before selecting samples.

800G OSFP cooling and thermal management

Record airflow, inlet temperature, adjacent-port occupancy, module power and diagnostic temperature under idle, sustained traffic and high-density states.

Link-up is only the first check

Observe errors, FEC, optical power, link flap, alarms, temperature and long-duration operation across target ports and software versions.

Keep cabling in the acceptance plan

Document MMF/SMF, MPO polarity, LC/CS interfaces, patch panels, connection count and total loss. Breakout also requires host lane mode and remote PMD alignment.

Test the final deployment conditions

Use the final host, software, fiber, reach, traffic and environmental conditions. One successful lab port does not cover every platform.

Control batch and version changes

Preserve coding, labels, module version, test conditions and batch records. Repeat critical tests after host software, line-card or module changes.