Is link-up enough?
No. Validate diagnostics, FEC, errors, optical power, power, temperature, flap and duration.
Compatibility Validation
Scope compatibility by host, software, port mode and link conditions, including EEPROM, diagnostics, FEC, errors, power, thermal and aging checks.
Delivery FAQ
No. Validate diagnostics, FEC, errors, optical power, power, temperature, flap and duration.
Provide host, line card, software, port, rate, mode, FEC, reach, fiber and criteria.
No. Keep the exact hardware, software, port mode and link conditions with the result.
Core Capabilities
Record platform, software, port mode, FEC and power limits.
Evaluate link-up, diagnostics, errors, optical power, temperature and stability.
Control coding, labels, requested options, test records and version changes.
Delivery Process
List hosts, software, ports, rates, reach and acceptance criteria.
Record conditions, results, exceptions and follow-up actions.
Keep traceability and repeat critical tests after version changes.
Recommended Products
Application Scenarios
400G / 800G high-density interconnect
View application →100G–800G Spine-Leaf
View application →SR / VR / AOC / DAC
View application →FR / LR / ER and WDM links
View application →155M–25G / FC / BiDi / WDM
View application →Selection Guides